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PROFET(R) BTS 733 L1
Smart Two Channel Highside Power Switch
Features
* Overload protection * Current limitation * Short-circuit protection * Thermal shutdown * Overvoltage protection (including load dump) * Reverse battery protection1) * Undervoltage and overvoltage shutdown with auto-restart and hysteresis * Open drain diagnostic output * Open load detection in ON-state * CMOS compatible input * Loss of ground and loss of Vbb protection * Electrostatic discharge (ESD) protection
Product Summary Overvoltage Protection Operating voltage active channels: On-state resistance RON Nominal load current IL(NOM) Current limitation IL(SCr)
Vbb(AZ) Vbb(on) one 40 4.8 21
43 V 5.0 ... 24 V two parallel 20 m 7.3 A 21 A
Application
* C compatible power switch with diagnostic feedback for 12 V DC grounded loads * Most suitable for resistive and lamp loads * Replaces electromechanical relays, fuses and discrete circuits
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input and diagnostic feedback, monolithically integrated in Smart SIPMOS(R) technology. Fully protected by embedded protection functions.
Pin Definitions and Functions Pin 1,10, 11,12, 15,16, 19,20 3 7 17,18 13,14 4 8 2 6 5,9 Symbol Function Positive power supply voltage. Design the Vbb wiring for the simultaneous max. short circuit currents from channel 1 to 2 and also for low thermal resistance IN1 Input 1,2, activates channel 1,2 in case of IN2 logic high signal OUT1 Output 1,2, protected high-side power output OUT2 of channel 1,2. Design the wiring for the max. short circuit current ST1 Diagnostic feedback 1,2 of channel 1,2, ST2 open drain, low on failure GND1 Ground 1 of chip 1 (channel 1) GND2 Ground 2 of chip 2 (channel 2) N.C. Not Connected Pin configuration (top view) Vbb GND1 IN1 ST1 N.C. GND2 IN2 ST2 N.C. Vbb 1 2 3 4 5 6 7 8 9 10
*
20 19 18 17 16 15 14 13 12 11
Vbb Vbb OUT1 OUT1 Vbb Vbb OUT2 OUT2 Vbb Vbb
1)
With external current limit (e.g. resistor RGND=150 ) in GND connection, resistor in series with ST connection, reverse load current limited by connected load.
Semiconductor Group
1
10.96
BTS 733 L1 Block diagram
Two Channels; Open Load detection in on state;
+ Vbb
Voltage source
Overvoltage Current protection limit
Gate protection
Leadframe
VLogic
Voltage sensor Charge pump Level shifter Rectifier Open load
ST1 OUT117,18
3 4 1
Signal GND Chip 1
Temperature sensor Load
IN1
ESD
Logic
detection
R O1
GND1
Chip 1
GND1 Load GND + Vbb
Lead frame
OUT2 13,14
Logic and protection circuit of chip 2 (equivalent to chip 1)
7 8 6
Signal GND Chip 2
IN2
Load
ST2 R O2 GND2
Chip 2
(R) PROFET
GND2 Load GND
Leadframe connected to pin 1, 10, 11, 12, 15, 16, 19, 20
Maximum Ratings at Tj = 25C unless otherwise specified Parameter Supply voltage (overvoltage protection see page 4) Supply voltage for full short circuit protection Tj,start = -40 ...+150C Semiconductor Group 2 Symbol Values 43 24 Unit V V
Vbb Vbb
BTS 733 L1 Maximum Ratings at Tj = 25C unless otherwise specified Parameter Load current (Short-circuit current, see page 5) Load dump protection2) VLoadDump = UA + Vs, UA = 13.5 V RI3) = 2 , td = 200 ms; IN = low or high, each channel loaded with RL = 2.8 , Operating temperature range Storage temperature range Power dissipation (DC)5) Ta = 25C: (all channels active) Ta = 85C: Electrostatic discharge capability (ESD) (Human Body Model) Input voltage (DC) Current through input pin (DC) Current through status pin (DC)
see internal circuit diagram page 8
Symbol
Values self-limited 60 -40 ...+150 -55 ...+150 3.8 2.0 1.0 -10 ... +16 2.0 5.0
Unit A V C W kV V mA
IL VLoad dump4) Tj Tstg Ptot VESD VIN IIN IST
Thermal Characteristics
Parameter and Conditions Symbol min Thermal resistance junction - soldering point5),6) each channel: Rthjs 5) junction - ambient one channel active: Rthja all channels active: ---Values typ max -40 33 11 --Unit
K/W
Electrical Characteristics
Parameter and Conditions, each of the two channels
at Tj = 25 C, Vbb = 12 V unless otherwise specified
Symbol
Values min typ max
Unit
Load Switching Capabilities and Characteristics On-state resistance (Vbb to OUT) IL = 2 A each channel, Tj = 25C: RON Tj = 150C: two parallel channels, Tj = 25C:
--
36 67 18
40 75 20
m
2)
3) 4) 5) 6)
Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins, e.g. with a 150 resistor in the GND connection and a 15 k resistor in series with the status pin. A resistor for input protection is integrated. RI = internal resistance of the load dump test pulse generator VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839 Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70m thick) copper area for Vbb connection. PCB is vertical without blown air. See page 14 Soldering point: upper side of solder edge of device pin 15. See page 14
Semiconductor Group
3
BTS 733 L1
Parameter and Conditions, each of the two channels
at Tj = 25 C, Vbb = 12 V unless otherwise specified
Symbol
Values min typ max 4.4 6.7 -80 80 0.1 0.1 4.8 7.3 -180 250 ----
Unit A
one channel active: two parallel channels active: Device on PCB5), Ta = 85C, Tj 150C Output current while GND disconnected or pulled up; Vbb = 30 V, VIN = 0, see diagram page 9 Turn-on time7) to 90% VOUT: IN Turn-off time IN to 10% VOUT: RL = 12 , Tj =-40...+150C Slew rate on 7) 10 to 30% VOUT, RL = 12 , Tj =-40...+150C: 7) Slew rate off 70 to 40% VOUT, RL = 12 , Tj =-40...+150C: Operating Parameters Operating voltage8) Undervoltage shutdown Undervoltage restart
Nominal load current
IL(NOM)
IL(GNDhigh) ton toff
dV/dton -dV/dtoff
10 350 450 1 1
mA s
V/s V/s
Tj =-40...+150C: Tj =-40...+150C: Tj =-40...+25C: Tj =+150C: Undervoltage restart of charge pump see diagram page 13 Tj =-40...+150C: Undervoltage hysteresis Vbb(under) = Vbb(u rst) - Vbb(under) Overvoltage shutdown Tj =-40...+150C: Overvoltage restart Tj =-40...+150C: Overvoltage hysteresis Tj =-40...+150C: Overvoltage protection9) Tj =-40...+150C: I bb = 40 mA Standby current, all channels off Tj =25C: VIN = 0 Tj =150C: Leakage output current (included in Ibb(off)) VIN = 0 Operating current 10), VIN = 5V, Tj =-40...+150C IGND = IGND1 + IGND2, one channel on: two channels on:
Vbb(on) Vbb(under) Vbb(u rst) Vbb(ucp)
Vbb(under)
5.0 3.5 ---24 23 -42 ----
---5.6 0.2 --0.5 47 16 24 --
24 5.0 5.0 7.0 7.0 -34 ---40 50 20
V V V V V V V V V A A
Vbb(over) Vbb(o rst) Vbb(over) Vbb(AZ) Ibb(off) IL(off)
IGND
---
1.8 3.6
4 8
mA
7) 8)
See timing diagram on page 11. At supply voltage increase up to Vbb = 5.6 V typ without charge pump, VOUT Vbb - 2 V 9) see also VON(CL) in circuit diagram on page 8. 10) Add I , if I ST ST > 0
Semiconductor Group
4
BTS 733 L1
Parameter and Conditions, each of the two channels
at Tj = 25 C, Vbb = 12 V unless otherwise specified
Symbol
Values min typ max
Unit
Protection Functions Initial peak short circuit current limit, (see timing
diagrams, page 11)
each channel, Tj =-40C: IL(SCp) 52 65 75 42 53 63 Tj =25C: 23 31 43 Tj =+150C: two parallel channels twice the current of one channel Repetitive short circuit current limit, Tj = Tjt each channel IL(SCr) -21 --21 -two parallel channels
(see timing diagrams, page 11)
A
A
Initial short circuit shutdown time
Tj,start =-40C: toff(SC) Tj,start = 25C: Tjt Tjt
--150 --
3 2.5 -10
-----
ms
(see page 10 and timing diagrams on page 11)
Thermal overload trip temperature Thermal hysteresis Reverse Battery Reverse battery voltage 11) Drain-source diode voltage (Vout > Vbb) IL = - 4.8 A, Tj = +150C
C K
-Vbb -VON
---
-600
32 --
V mV
Diagnostic Characteristics Open load detection current, (on-condition) 100 -- 1200 each channel, Tj = -40C: I L (OL)4 100 -- 1000 Tj = 25C: 100 -- 1000 Tj = +150C: twice the current of one channel two parallel channels Open load detection voltage12) 2 3 4 Tj =-40..+150C: VOUT(OL) Internal output pull down 4 10 30 (OUT to GND), VOUT = 5 V Tj =-40..+150C: RO
mA
V k
Requires a 150 resistor in GND connection. The reverse load current through the intrinsic drain-source diode has to be limited by the connected load. Power dissipation is higher compared to normal operating conditions due to the voltage drop across the drain-source diode. The temperature protection is not active during reverse current operation! Input and Status currents have to be limited (see max. ratings page 3 and circuit page 8). 12) External pull up resistor required for open load detection in off state.
11)
Semiconductor Group
5
BTS 733 L1
Parameter and Conditions, each of the two channels
at Tj = 25 C, Vbb = 12 V unless otherwise specified
Symbol
Values min typ max
Unit
Input and Status Feedback13) Input resistance
(see circuit page 8)
RI Tj =-40..+150C: VIN(T+) VIN(T-)
VIN(T) IIN(off)
2.5 1.7 1.5 -1 20 100 --
3.5 --0.5 -50 520 250
6 3.3 --50 90 1000 600
k V V V A A s s
Input turn-on threshold voltage Input turn-off threshold voltage
Tj =-40..+150C:
Input threshold hysteresis VIN = 0.4 V: Off state input current Tj =-40..+150C: VIN = 5 V: On state input current Tj =-40..+150C: Delay time for status with open load after switch off Tj =-40..+150C: (see timing diagrams, page 12), Status invalid after positive input slope Tj =-40..+150C: (open load) Status output (open drain) Zener limit voltage Tj =-40...+150C, IST = +1.6 mA: ST low voltage Tj =-40...+25C, IST = +1.6 mA: Tj = +150C, IST = +1.6 mA:
IIN(on) td(ST OL4) td(ST)
VST(high) VST(low)
5.4 ---
6.1 ---
-0.4 0.6
V
13)
If ground resistors RGND are used, add the voltage drop across these resistors.
Semiconductor Group
6
BTS 733 L1 Truth Table
Channel 1 Channel 2 Input 1 Input 2 level Normal operation Open load Short circuit to Vbb Overtemperature Undervoltage Overvoltage L = "Low" Level H = "High" Level L H L H L H L H L H L H Output 1 Output 2 level L H Z H H H L L L L L L Status 1 Status 2
BTS 733L1
H H H (L14)) L L15) H (L16)) H L H H H H
X = don't care Z = high impedance, potential depends on external circuit Status signal valid after the time delay shown in the timing diagrams
Parallel switching of channel 1 and 2 is easily possible by connecting the inputs and outputs in parallel. The status outputs ST1 and ST2 have to be configured as a 'Wired OR' function with a single pull-up resistor.
Terms
Ibb V bb Leadframe I IN1 3 I ST1 V IN1 VST1 4 ST1 IN1 Vbb I L1 PROFET Chip 1 GND1 2 R GND1 I GND1 VOUT1 OUT1 17,18 V VON1 I ST2 V ST2 8 ST2 I IN2 7 IN2 Leadframe Vbb I L2 PROFET Chip 2 GND2 6 R GND2 IGND2 VOUT2 OUT2 13,14 VON2
IN2
Leadframe (Vbb) is connected to pin 1,10,11,12,15,16,19,20 External RGND optional; two resistors RGND1, RGND2 = 150 or a single resistor RGND = 75 for reverse battery protection up to the max. operating voltage.
14) 15)
With external resistor between output and Vbb An external short of output to Vbb in the off state causes an internal current from output to ground. If R GND is used, an offset voltage at the GND and ST pins will occur and the VST low signal may be errorious. 16) Low resistance to V may be detected by no-load-detection bb
Semiconductor Group
7
BTS 733 L1
Input circuit (ESD protection), IN1 or IN2
R IN I
+ V bb
Overvoltage protection of logic part
GND1 or GND2
ESD-ZD I GND
I
I
IN
V
RI Logic
Z2
ESD zener diodes are not to be used as voltage clamp at DC conditions. Operation in this mode may result in a drift of the zener voltage (increase of up to 1 V).
R ST
ST V
Z1
PROFET
GND
Status output, ST1 or ST2
+5V
R GND
Signal GND
VZ1 = 6.1 V typ., VZ2 = 47 V typ., RI = 3.5 k typ., RGND = 150 , RST = 15 k nominal.
R ST(ON)
ST
Reverse battery protection
GND ESDZD
5V - Vbb
ESD-Zener diode: 6.1 V typ., max 5.0 mA; RST(ON) < 375 at 1.6 mA, ESD zener diodes are not to be used as voltage clamp at DC conditions. Operation in this mode may result in a drift of the zener voltage (increase of up to 1 V).
R ST
IN ST
RI
Logic
OUT
Power Inverse Diode
overvoltage output clamp, OUT1 or OUT2
+Vbb VZ
GND R GND
Signal GND
RL
Power GND
RGND = 150 , RI = 3.5 k typ,
V ON OUT
Temperature protection is not active during inverse current operation.
PROFET
Power GND
VON clamped to VON(CL) = 47 V typ.
Semiconductor Group
8
BTS 733 L1
Open-load detection, OUT1 or OUT2 ON-state diagnostic condition: VON < RON*IL(OL); IN high
+ V bb
GND disconnect with GND pull up
IN
Vbb PROFET OUT
ST
ON
VON
GND
OUT
V
V bb
V IN ST
V
Logic unit
Open load detection
GND
If VGND > VIN - VIN(T+) device stays off Due to VGND > 0, no VST = low signal available.
OFF-state diagnostic condition: VOUT > 3 V typ.; IN low
R
EXT
OFF
V OUT
Logic unit
Open load detection
R
O
Signal GND
GND disconnect
IN
Vbb PROFET OUT
ST GND V bb V IN V ST V GND
In case of IN = high is VOUT VIN - VIN(T+). Due to VGND > 0, no VST = low signal available.
Semiconductor Group
9
BTS 733 L1
Typ. on-state resistance
RON = f (Vbb,Tj ); IL = 2 A, IN = high RON [mOhm]
120
Typ. standby current
Ibb(off) = f (Tj ); Vbb = 9...24 V, IN1,2 = low Ibb(off) [A]
45 40
100 35 80 Tj = 150C 60 85C 40 25C -40C 20 5 0 0 10 20 30 0 -50 0 50 100 150 200 20 15 10 30 25
Vbb [V]
Tj [C]
Typ. open load detection current
IL(OL) = f (Vbb,Tj ); IN = high IL(OL) [mA]
1000 900 800 700 600 500 400 300 200 100 0 0 5 10 15 20 25 no-load detection not specified for Vbb < 6 V 25C -40C
Typ. initial short circuit shutdown time
toff(SC) = f (Tj,start ); Vbb =12 V toff(SC) [msec]
3
2.5
2
85C 1.5 Tj = 150C
1
0.5
0 -50
0
50
100
150
200
Vbb [V]
Tj,start [C]
Semiconductor Group
10
BTS 733 L1
Timing diagrams
Both channels are symmetric and consequently the diagrams are valid for channel 1 and channel 2
Figure 1a: Vbb turn on:
IN1 IN IN2
Figure 2b: Switching a lamp:
V bb
ST
V
OUT1
V
OUT
V
OUT2
I
L
ST open drain t t
The initial peak current should be limited by the lamp and not by the initial short circuit current IL(SCp) = 53 A typ. of the device.
Figure 2a: Switching a resistive load, turn-on/off time and slew rate definition:
Figure 3a: Turn on into short circuit: shut down by overtemperature, restart by cooling
IN1 other channel: normal operation
IN
VOUT
90% t on dV/dton 10% t dV/dtoff I
L1
I
off
L(SCp) I L(SCr)
IL
t ST t t
Heating up of the chip may require several milliseconds, depending on external conditions (toff(SC) vs. Tj,start see page 10)
off(SC)
Semiconductor Group
11
BTS 733 L1
Figure 3b: Turn on into short circuit: shut down by overtemperature, restart by cooling (two parallel switched channels 1 and 2)
IN1/2
Figure 5a: Open load: detection in ON-state, turn on/off to open load
IN
I
L1
+I
L2
I L(SCp)
ST
t d(ST)
t
d(ST OL4)
V I L(SCr)
OUT
t ST1/2
off(SC)
I
L
open t t
ST1 and ST2 have to be configured as a 'Wired OR' function ST1/2 with a single pull-up resistor.
The status delay td(ST OL4) is for differentiation between the failure modes "open load in ON-state" and "overtemperature"; td(ST OL4) only appears after turn off to open load.
Figure 4a: Overtemperature: Reset if Tj IN
Figure 5b: Open load: detection in ON-state, open load occurs in on-state
IN
ST ST
t d(ST OL1)
t
d(ST OL2)
V
OUT
V
OUT
T
J
I t
normal
L
open
normal
t
td(ST OL1) = 20 s typ., td(ST OL2) = 10 s typ
Semiconductor Group
12
BTS 733 L1
Figure 5c: Open load: detection in ON- and OFF-state (with REXT), turn on/off to open load Figure 6b: Undervoltage restart of charge pump
V on IN VON(CL)
ST
t
d(ST)
off-state
on-state
V
V
bb(over)
OUT
V
V V
bb(u rst)
bb(o rst)
I
L
bb(u cp)
open t
V bb(under) V bb
IN = high, normal load conditions. Charge pump starts at Vbb(ucp) = 5.6 V typ.
Figure 6a: Undervoltage: Figure 7a: Overvoltage:
IN IN V bb V V V bb
bb(u rst)
V ON(CL)
Vbb(over)
V bb(o rst)
bb(under)
V
OUT
V
OUT
ST ST t t
Semiconductor Group
13
off-state
BTS 733 L1
Package and Ordering Code
Standard P-DSO-20-9
BTS733L1 Ordering Code Q67060-S7008-A2
All dimensions in millimetres 1) Does not include plastic or metal protrusions of 0.15 max per side 2) Does not include dambar protrusion of 0.05 max per side
Definition of soldering point with temperature Ts: upper side of solder edge of device pin 15.
Pin 15
Printed circuit board (FR4, 1.5mm thick, one layer 70m, 6cm2 active heatsink area) as a reference for max. power dissipation Ptot, nominal load current IL(NOM) and thermal resistance Rthja
Semiconductor Group
14

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